In the era of rapid development of artificial intelligence technology, the requirements for hardware performance have become increasingly stringent. As the core component of electronic products, the performance and technical level of PCBA directly affect the operational efficiency and application effectiveness of AI devices. OMAGINE, specializing in one-stop services for small and medium-batch PCBA production, has actively invested in research and development to meet the special needs of the AI field, achieving a series of remarkable new technologies and R&D outcomes.
High-Performance Chip Integration Technology
Heterogeneous Chip Integration Innovation: AI devices often require multiple types of chips to work together, such as CPUs, GPUs, and AI-specific chips (NPUs). OMAGINE has developed advanced heterogeneous chip integration technology, enabling efficient integration of various chips within limited PCB space. By optimizing the electrical connections and signal transmission lines between chips, communication latency is reduced, and data transfer speed is increased. In a PCBA for AI devices targeted at smart security surveillance, a high-performance GPU and an NPU designed for image recognition were successfully integrated, enabling the device to excel in real-time video analysis and target recognition tasks, with recognition accuracy improved by over 15%.
Chip Cooling and Power Management Optimization: High-performance chips generate significant heat during operation and have high requirements for power stability. To address this issue, OMAGINE has developed integrated chip cooling and power management technology. Utilizing novel cooling materials and structures, such as vapor chambers and graphite cooling sheets, combined with an intelligent cooling control system, the cooling power can be automatically adjusted based on the chip’s operating status, ensuring stable operation even in high-temperature environments. In terms of power management, efficient power conversion circuits have been designed, improving power utilization, reducing power consumption, and enhancing the power supply’s anti-interference capability, providing stable and reliable power to the chips.
High-Speed Data Transmission and Processing Technology
High-Speed Signal Transmission Line Design: AI applications involve massive amounts of data, placing extremely high demands on data transmission speed. OMAGINE has developed high-speed signal transmission line design technology. By optimizing the PCB’s wiring structure and material selection, employing differential signal transmission, impedance matching, and other technical means, the rate and stability of signal transmission have been effectively improved. In designing PCBA for AI servers, data transmission rates have been increased to over 10Gbps, meeting the server’s demand for rapid transmission of large data volumes and significantly enhancing the training and inference efficiency of AI models.
Data Processing Acceleration Technology: To further enhance the data processing capabilities of AI devices, OMAGINE has developed data processing acceleration technology. At the hardware level, by adding hardware accelerators and optimizing data cache structures, accelerated processing of specific algorithms is achieved. At the software level, efficient data processing algorithms and drivers have been developed, working in synergy with the hardware to improve the parallelism and efficiency of data processing. After applying this technology in AI devices for natural language processing, text processing speed has been increased by more than two times, enabling rapid response to users’ voice commands and text queries.
Intelligent Production and Testing Technology
Intelligent SMT Production Process: To meet the high-precision and high-reliability requirements of PCBA for AI devices, OMAGINE has developed an intelligent SMT (Surface Mount Technology) production process. By introducing advanced automation equipment and intelligent control systems, the entire SMT process is automated and intelligent. Through machine learning algorithms, production data is analyzed and optimized in real-time, allowing automatic adjustment of SMT parameters to improve placement accuracy and production efficiency. During production, machine vision technology is utilized to inspect the quality of component placement in real-time, promptly identifying and correcting placement defects, reducing the defect rate by over 20%.
Intelligent Inspection and Fault Diagnosis System: A set of intelligent inspection and fault diagnosis systems has been developed for comprehensive inspection and fault diagnosis of PCBA. The system integrates multiple advanced inspection technologies, such as Automatic Optical Inspection (AOI), X-ray inspection, and functional testing, enabling comprehensive inspection of the PCBA’s appearance, internal structure, and electrical performance. By analyzing and processing inspection data with AI algorithms, fault points can be quickly and accurately located, and corresponding solutions provided. In the production process of AI devices, this system significantly improves inspection efficiency and accuracy, shortening the production cycle of the products.
OMAGINE specializing in ODM PCB design, PCB assembly, open source hardware related modules and sourcing service.
