The LED packaging industry serves as a crucial support and a significant sector for subsequent development within the industry of desiccant cabinets (also known as moisture-proof boxes, drying boxes, and drying cabinets), attracting close attention from major manufacturers. According to industry insiders’ predictions, the future development of LED packaging technology will mainly follow ten trends, which are briefly introduced below:

1. Medium power becomes the mainstream packaging method. Currently, products on the market are mostly high-power or low-power LED products, each with its advantages but also insurmountable defects. In response, medium-power LED products, combining the advantages of both, have emerged and become the mainstream packaging method.

2. Application of new materials in packaging. Due to their higher environmental tolerance, such as high temperature resistance, UV resistance, and low water absorption, materials like thermoset EMC, thermoplastic PCT, modified PPA, and ceramic-like plastics will be widely used.

3. Application of high chip current density. In the future, chip current density will increase from 350MA/mm² to 700MA/mm², or even higher. Additionally, chips will require lower voltages, smoother VI curves (lower heat generation), and a balance between ESD and VF.

4. Popularization of COB applications. With advantages such as low thermal resistance, good light pattern, solder-free assembly, and low cost, COB applications will become widely popularized in the future.

5. Demand for higher light quality. Primarily targeting indoor lighting, Jingtai Optoelectronics will aim for an LED indoor lighting product RA of 80 as the standard and strive for an RA of 90, ensuring the light color of lighting products is as close as possible to the Planckian locus, resulting in uniform and glare-free light.

6. Further improvement of international and domestic standards. With the continuous advancement of LED packaging technology, it is believed that domestic and international quality standards for LED products will also continue to improve.

7. Integrated packaged optical engines become the packaging value proposition. Integrated packaged optical engines will be the focus of Jingtai’s next quarter of research and development.

8. Power supply-free solutions (high-voltage LEDs). Future indoor lighting will focus more on quality, and driven by cost considerations, power supply-free solutions will gradually become acceptable products. High-voltage LEDs fully cater to this trend, but they need to address enhanced chip reliability.

9. Multicolor LED light sources suitable for ambient lighting. Ambient lighting will be the core competitiveness of LED lighting, and the second takeoff of LED lighting in the future will rely on ambient lighting.

10. Relative decrease in demand for luminous efficiency, with cost-effectiveness becoming the winning strategy for packaging factories. Future indoor lighting will not focus too much on luminous efficiency but will prioritize light quality. With advancements in packaging technology, the cost reduction of LED luminaires has become the driving force for replacing traditional lighting sources.